ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,494, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Jihoo... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,495, issued on July 21, was assigned to Nexperia Technology (Shanghai) Ltd. (Shanghai) and Nexperia B.V. (Nijmegen, Netherlands). "Package ... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,496, issued on July 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Three dimensional heterogeneous int... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,497, issued on July 21, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module" was invented by Hiroyuki Nogawa (M... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,498, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Chaje... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,499, issued on July 21, was assigned to Daktronics Inc. (Brookings, S.D.). "Controlling adhesive reflow for transfer printing" was invented... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,500, issued on July 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with spacer and method for ... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,501, issued on July 21, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Electrical redundancy for bonded... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,502, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method of manufact... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,503, issued on July 21, was assigned to Renesas Electronics Corp. (Tokyo). "Semiconductor device and method of manufacturing the same" was ... Read More